Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/13529
Title: Impact testing and analysis of adhesive bonds
Authors: Cheng, Soon Kiong.
Keywords: DRNTU::Engineering::Materials::Material testing and characterization
Issue Date: 1998
Abstract: The project attempts to develop an impact reliability testing analysis methodology for adhesive bonded joints used commonly in structural and electronic packaging applications. This is especially applicable to portable mechanical and electronic products that are prone to dropping from height and yet expected to work reliably after dropping.
URI: http://hdl.handle.net/10356/13529
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Theses

Files in This Item:
File Description SizeFormat 
CHENG_SOON_KIONG_1998.pdf
  Restricted Access
3.96 MBAdobe PDFView/Open

Google ScholarTM

Check

Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.