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Title: Impact testing and analysis of adhesive bonds
Authors: Cheng, Soon Kiong.
Keywords: DRNTU::Engineering::Materials::Material testing and characterization
Issue Date: 1998
Abstract: The project attempts to develop an impact reliability testing analysis methodology for adhesive bonded joints used commonly in structural and electronic packaging applications. This is especially applicable to portable mechanical and electronic products that are prone to dropping from height and yet expected to work reliably after dropping.
Schools: School of Mechanical and Production Engineering 
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Theses

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