Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/136600
Title: An enhanced static compensator with dc-link voltage shaping method
Authors: Jeon, Young-Tae
Townsend, Christopher David
Tafti, Hossein Dehghani
Ramos, Ezequiel Rodriguez
Farivar, Glen G.
Park, Joung-Hu
Pou, Josep
Keywords: Engineering::Electrical and electronic engineering
Issue Date: 2020
Source: Jeon, Y.-T., Townsend, C. D., Tafti, H. D., Ramos, E. R., Farivar, G. G., Park, J.-H., & Pou, J. (2020). An enhanced static compensator with dc-link voltage shaping method. IEEE Transactions on Power Electronics, 35(3), 2488-2500. doi:10.1109/TPEL.2019.2928367
Journal: IEEE Transactions on Power Electronics
Abstract: This paper proposes a dc-link voltage shaping method for a cascaded H-bridge (CHB) static synchronous compensator (StatCom). A recently proposed low capacitance-StatCom system, which intentionally operates with large voltage ripples on the dc-link capacitors, offers the advantage of superior harmonic performance. However, the capacitor voltage ripples decrease when operating at below-rated reactive current, which removes the aforementioned harmonic performance benefit of this system. In addition, such harmonic performance benefit is only achieved in capacitive operation mode. In order to expand the operating region where advantageous voltage ripples are present, a new voltage shaping method is proposed. The proposed method uses a CHB multilevel converter coupled with simple dc-dc converters to shape voltage ripples on the dc-link capacitor regardless of its operating point. This is achieved by controlling the average current of the dc-dc converter using model predictive control (MPC). The concept is best applied to an enhanced StatCom, or E-StatCom, application in which the StatCom is integrated with either a renewable energy source or energy storage system. The operational principle of the proposed approach is validated via simulation and experimental results on a five-level single-phase CHB StatCom.
URI: https://hdl.handle.net/10356/136600
ISSN: 0885-8993
DOI: 10.1109/TPEL.2019.2928367
Rights: © 2019 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. The published version is available at: https://doi.org/10.1109/TPEL.2019.2928367
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:EEE Journal Articles

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