Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/136724
Title: HNTs/SiO2 dual-network aerogels with improved strength and thermal insulation
Authors: Liu, Hongli
Li, Shixiong
Li, Hongyan
Chen, Zhong
Li, Jing
Li, Yajing
Keywords: Engineering::Materials
Issue Date: 2018
Source: Liu, H., Li, S., Li, H., Chen, Z., Li, J., & Li, Y. (2018). HNTs/SiO2 dual-network aerogels with improved strength and thermal insulation. Journal of Sol-Gel Science and Technology, 88(3), 519-527. doi:10.1007/s10971-018-4851-3
Journal: Journal of Sol-Gel Science and Technology
Abstract: Dual-network aerogels (HPSA) with improved mechanical property and thermal insulation were prepared by vacuum impregnation of HNTs/PVA aerogels (the first network aerogel, HPA) in tetraethoxysilane (TEOS). Scanning electron microscopy, transmission electron microscopy, energy dispersive spectroscopy, and N2 adsorption–desorption analysis were used to study micromorphology and microstructure of HPSA, while compression tests and thermal conductivity tests were used to investigate related properties. The results showed that the dual-network frame was successfully constructed, this enabled HPSA to display enhanced compressive properties with increased HNTs content. The addition of silica sol improved the mesoporous characteristics including specific surface area and pore volume and also reduced the thermal conductivities. The first network made it possible for HPSA to possess good mechanical property, while SiO2 aerogel allowed HPSA greater thermal insulation. The obtained aerogel samples exhibited a high compressive strength (i.e., 1.36 MPa) and a low thermal conductivity (i.e., 0.022 W/(m K)). HNTs/SiO2 dual-network aerogels with improved strength and thermal insulation could show great potential in a wide variety of applications.
URI: https://hdl.handle.net/10356/136724
ISSN: 0928-0707
DOI: 10.1007/s10971-018-4851-3
Rights: This is a post-peer-review, pre-copyedit version of an article published in Journal of Sol-Gel Science and Technology. The final authenticated version is available online at: http://dx.doi.org/10.1007/s10971-018-4851-3.
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:MSE Journal Articles

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