Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/137068
Title: Hierarchically distributed microstructure design of haptic sensors for personalized fingertip mechanosensational manipulation
Authors: Liao, Xinqin
Wang, Wensong
Lin, Maohua
Li, Minghua
Wu, Hualin
Zheng, Yuanjin
Keywords: Engineering::Electrical and electronic engineering
Issue Date: 2018
Source: Liao, X., Wang, W., Lin, M., Li, M., Wu, H., & Zheng, Y. (2018). Hierarchically distributed microstructure design of haptic sensors for personalized fingertip mechanosensational manipulation. Materials Horizons, 5(5), 920-931. doi:10.1039/C8MH00680F
Journal: Materials Horizons
Abstract: Strategies to help reconstruct and restore haptic perception are essential for control of prosthetic limbs, clinical rehabilitation evaluation, and robotic manipulation. Here, we propose a hierarchically distributed microstructure based on electric contact theory to develop haptic sensors. The sensing range of the haptic sensor based on a hierarchically distributed microstructure is greatly enhanced by ten times relative to the one of the haptic sensor based on a common structure. Furthermore, variation in the response signal of the haptic sensor is up to five orders of magnitude and scales with the external pressure between 0.5 and 100 kPa, which is close to the range that a finger normally feels. Personalized manipulation of electrical appliances, a three-dimensional password matrix, and gesture control of a data glove demonstrate the fascinating potential of the haptic sensors for human–machine interactive systems, force-enhanced security systems, and wearable electrical systems.
URI: https://hdl.handle.net/10356/137068
ISSN: 2051-6347
DOI: 10.1039/C8MH00680F
Schools: School of Electrical and Electronic Engineering 
Rights: © 2018 The Royal Society of Chemistry. All rights reserved. This paper was published in Materials Horizons and is made available with permission of The Royal Society of Chemistry.
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:EEE Journal Articles

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