Please use this identifier to cite or link to this item:
Title: 3D printing of flexible electronic devices
Authors: Yang, Hui
Leow, Wan Ru
Chen, Xiaodong
Keywords: Engineering::Materials
Issue Date: 2017
Source: Yang, H., Leow, W. R., & Chen, X. (2018). 3D printing of flexible electronic devices. Small Methods, 2(1), 1700259-. doi:10.1002/smtd.201700259
Journal: Small Methods
Abstract: Compared to traditional, simple, planar or tubular flexible devices fabricated by spin-coating, casting, or extrusion, 3D-printed flexible electronic devices possess complicated geometries with precisely prescribed microarchitectures and excellent mechanical properties for satisfying all kinds of individual requirements. However, the full utilization of 3D-printing technology to realize 3D-printed flexible electronic devices remains limited by the flexibility and conductivity of 3D-printing materials. To achieve 3D-printed flexible electronic devices, the flexibility of 3D-printed flexible devices and functionalization of conductive materials or hard silicon-based electronic devices are combined. These 3D-printed flexible electronic devices can be applied widely in the fields of personal wearable devices, prosthetic organs for the disabled, and human–computer interfaces. To further promote the rapid advent of 3D-printed flexible electronic devices, the recent strategies and future developmental directions of fabricating these complex electronic devices are discussed here.
ISSN: 2366-9608
DOI: 10.1002/smtd.201700259
Rights: © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim. All rights reserved.
Fulltext Permission: none
Fulltext Availability: No Fulltext
Appears in Collections:MSE Journal Articles

Citations 5

Updated on Mar 2, 2021

Citations 5

Updated on Mar 5, 2021

Page view(s)

Updated on Apr 18, 2021

Google ScholarTM




Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.