Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/138563
Title: Ultrafast spin‐to‐charge conversion at the surface of topological insulator thin films
Authors: Wang, Xinbo
Cheng, Liang
Zhu, Dapeng
Wu, Yang
Chen, Mengji
Wang, Yi
Zhao, Daming
Boothroyd, Chris Brian
Lam, Yeng Ming
Zhu, Jian-Xin
Battiato, Marco
Song, Justin Chien Wen
Yang, Hyunsoo
Chia, Elbert Ee Min
Keywords: Science::Physics
Issue Date: 2018
Source: Wang, X., Cheng, L., Zhu, D., Wu, Y., Chen, M., Wang, Y., . . . Chia, E. E. M. (2018). Ultrafast spin‐to‐charge conversion at the surface of topological insulator thin films. Advanced Materials, 30(52), 1802356-. doi:10.1002/adma.201802356
Journal: Advanced Materials
Abstract: Strong spin–orbit coupling, resulting in the formation of spin‐momentum‐locked surface states, endows topological insulators with superior spin‐to‐charge conversion characteristics, though the dynamics that govern it have remained elusive. Here, an all‐optical method is presented, which enables unprecedented tracking of the ultrafast dynamics of spin‐to‐charge conversion in a prototypical topological insulator Bi2Se3/ferromagnetic Co heterostructure, down to the sub‐picosecond timescale. Compared to pure Bi2Se3 or Co, a giant terahertz emission is observed in the heterostructure that originates from spin‐to‐charge conversion, in which the topological surface states play a crucial role. A 0.12 ps timescale is identified that sets a technological speed limit of spin‐to‐charge conversion processes in topological insulators. In addition, it is shown that the spin‐to‐charge conversion efficiency is temperature independent in Bi2Se3 as expected from the nature of the surface states, paving the way for designing next‐generation high‐speed optospintronic devices based on topological insulators at room temperature.
URI: https://hdl.handle.net/10356/138563
ISSN: 0935-9648
DOI: 10.1002/adma.201802356
Rights: © 2018 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim. All rights reserved. This paper was published in Advanced Materials and is made available with permission of WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:SPMS Journal Articles

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