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Title: Plasticizing silk protein for on-skin stretchable electrodes
Authors: Chen, Geng
Matsuhisa, Naoji
Liu, Zhiyuan
Qi, Dianpeng
Cai, Pingqiang
Jiang, Ying
Wan, Changjin
Cui, Yajing
Leow, Wan Ru
Liu, Zhuangjian
Gong, Suxuan
Zhang, Ke-Qin
Cheng, Yuan
Chen, Xiaodong
Keywords: Engineering::Materials
Issue Date: 2018
Source: Chen, G., Matsuhisa, N., Liu, Z., Qi, D., Cai, P., Jiang, Y., . . . Chen, X. (2018). Plasticizing silk protein for on-skin stretchable electrodes. Advanced Materials, 30(21), 1800129-. doi:10.1002/adma.201800129
Journal: Advanced Materials
Abstract: Soft and stretchable electronic devices are important in wearable and implantable applications because of the high skin conformability. Due to the natural biocompatibility and biodegradability, silk protein is one of the ideal platforms for wearable electronic devices. However, the realization of skin-conformable electronic devices based on silk has been limited by the mechanical mismatch with skin, and the difficulty in integrating stretchable electronics. Here, silk protein is used as the substrate for soft and stretchable on-skin electronics. The original high Young's modulus (5-12 GPa) and low stretchability (<20%) are tuned into 0.1-2 MPa and > 400%, respectively. This plasticization is realized by the addition of CaCl2 and ambient hydration, whose mechanism is further investigated by molecular dynamics simulations. Moreover, highly stretchable (>100%) electrodes are obtained by the thin-film metallization and the formation of wrinkled structures after ambient hydration. Finally, the plasticized silk electrodes, with the high electrical performance and skin conformability, achieve on-skin electrophysiological recording comparable to that by commercial gel electrodes. The proposed skin-conformable electronics based on biomaterials will pave the way for the harmonized integration of electronics into human.
ISSN: 0935-9648
DOI: 10.1002/adma.201800129
Rights: © 2018 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim. All rights reserved. This paper was published in Advanced Materials and is made available with permission of WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:MSE Journal Articles

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