Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/138701
Title: 0.2 λ0 thick adaptive retroreflector made of spin-locked metasurface
Authors: Yan, Libin
Zhu, Weiming
Muhammad Faeyz Karim
Cai, Hong
Gu, Alex Yuandong
Shen, Zhongxiang
Chong, Peter Han Joo
Kwong, Dim-Lee
Qiu, Cheng-Wei
Liu, Ai Qun
Keywords: Engineering::Electrical and electronic engineering
Issue Date: 2018
Source: Yan, L., Zhu, W., Muhammad Faeyz Karim, Cai, H., Gu, A. Y., Shen, Z., . . . Liu, A. Q. (2018). 0.2 λ0 thick adaptive retroreflector made of spin-locked metasurface. Advanced materials, 30(39), 1802721-. doi:10.1002/adma.201802721
Journal: Advanced materials
Abstract: The metasurface concept is employed to planarize retroflectors by stacking two metasurfaces with separation that is two orders larger than the wavelength. Here, a retroreflective metasurface using subwavelength-thick reconfigurable C-shaped resonators (RCRs) is reported, which reduces the overall thickness from the previous record of 590 λ0 down to only 0.2 λ0 . The geometry of RCRs could be in situ controlled to realize equal amplitude and phase modulation onto transverse magnetic (TM)-polarized and transverse electric (TE)-polarized incidences. With the phase gradient being engineered, an in-plane momentum could be imparted to the incident wave, guaranteeing the spin state of the retro-reflected wave identical to that of the incident light. Such spin-locked metasurface is natively adaptive toward different incident angles to realize retroreflection by mechanically altering the geometry of RCRs. As a proof of concept, an ultrathin retroreflective metasurface is validated at 15 GHz, under various illumination angles at 10°, 12°, 15°, and 20°. Such adaptive spin-locked metasurface could find promising applications in spin-based optical devices, communication systems, remote sensing, RCS enhancement, and so on.
URI: https://hdl.handle.net/10356/138701
ISSN: 0935-9648
DOI: 10.1002/adma.201802721
Rights: © 2018 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim. All rights reserved. This paper was published in Advanced materials and is made available with permission of WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim.
Fulltext Permission: none
Fulltext Availability: No Fulltext
Appears in Collections:EEE Journal Articles

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