Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/138809
Title: Boron nitride coated three-dimensional graphene as an electrically insulating electromagnetic interference shield
Authors: Ngoh, Zhi Lin
Leong, Fei Ni
Tay, Roland Yijie
Whiteside, Matthew David
Chng, Soon Siang
Yu, Jong Jen
Tsang, Siu Hon
Tan, Dunlin
Ng, Geok Ing
Teo, Edwin Hang Tong
Keywords: Engineering::Electrical and electronic engineering
Engineering::Materials
Issue Date: 2019
Source: Ngoh, Z. L., Leong, F. N., Tay, R. Y., Whiteside, M. D., Chng, S. S., Yu, J. J., . . . Teo, E. H. T. (2019). Boron nitride coated three-dimensional graphene as an electrically insulating electromagnetic interference shield. Proceeding of the 2019 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP), 127-129. doi:10.1109/IMWS-AMP.2019.8880119
Abstract: We demonstrate the potential of a novel hybrid nanostructure three-dimensional graphene (3D-C) coated with boron nitride (BN) as an electromagnetic interference (EMI) shield. BN, deposited by sputtering, encapsulates 3D-C to form a light-weight graphene based EM shield that has an electrically insulating exterior. The BN deposited on 3D-C was homogeneously distributed with even coverage on the struts of 3D-C. EMI shielding results have shown that the hybrid material has a total shielding effectiveness (SET) of 53dB and 58dB in the X band and Ku band respectively.
URI: https://hdl.handle.net/10356/138809
ISBN: 9781728109374
DOI: 10.1109/IMWS-AMP.2019.8880119
Rights: © 2019 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. The published version is available at: https://doi.org/10.1109/IMWS-AMP.2019.8880119
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:EEE Conference Papers

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