Please use this identifier to cite or link to this item:
https://hdl.handle.net/10356/138809
Title: | Boron nitride coated three-dimensional graphene as an electrically insulating electromagnetic interference shield | Authors: | Ngoh, Zhi Lin Leong, Fei Ni Tay, Roland Yijie Whiteside, Matthew David Chng, Soon Siang Yu, Jong Jen Tsang, Siu Hon Tan, Dunlin Ng, Geok Ing Teo, Edwin Hang Tong |
Keywords: | Engineering::Electrical and electronic engineering Engineering::Materials |
Issue Date: | 2019 | Source: | Ngoh, Z. L., Leong, F. N., Tay, R. Y., Whiteside, M. D., Chng, S. S., Yu, J. J., . . . Teo, E. H. T. (2019). Boron nitride coated three-dimensional graphene as an electrically insulating electromagnetic interference shield. Proceeding of the 2019 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP), 127-129. doi:10.1109/IMWS-AMP.2019.8880119 | Conference: | IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP) | Abstract: | We demonstrate the potential of a novel hybrid nanostructure three-dimensional graphene (3D-C) coated with boron nitride (BN) as an electromagnetic interference (EMI) shield. BN, deposited by sputtering, encapsulates 3D-C to form a light-weight graphene based EM shield that has an electrically insulating exterior. The BN deposited on 3D-C was homogeneously distributed with even coverage on the struts of 3D-C. EMI shielding results have shown that the hybrid material has a total shielding effectiveness (SET) of 53dB and 58dB in the X band and Ku band respectively. | URI: | https://hdl.handle.net/10356/138809 | ISBN: | 9781728109374 | DOI: | 10.1109/IMWS-AMP.2019.8880119 | Schools: | School of Electrical and Electronic Engineering | Organisations: | CNRS International NTU Thales Research Alliance | Research Centres: | Advanced Materials Research Centre Temasek Laboratories |
Rights: | © 2019 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. The published version is available at: https://doi.org/10.1109/IMWS-AMP.2019.8880119 | Fulltext Permission: | open | Fulltext Availability: | With Fulltext |
Appears in Collections: | EEE Conference Papers |
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