Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/138885
Title: A deformable and highly robust ethyl cellulose transparent conductor with a scalable silver nanowires bundle micromesh
Authors: Xiong, Jiaqing
Li, Shaohui
Ye, Yiyang
Wang, Jiangxin
Qian, Kai
Cui, Peng
Gao, Dace
Lin, Meng-Fang
Chen, Tupei
Lee, Pooi See
Keywords: Engineering::Materials
Issue Date: 2018
Source: Xiong, J., Li, S., Ye, Y., Wang, J., Qian, K., Cui, P., . . . Lee, P. S. (2018). A deformable and highly robust ethyl cellulose transparent conductor with a scalable silver nanowires bundle micromesh. Advanced Materials, 30(36), 1802803-. doi:10.1002/adma.201802803
Journal: Advanced Materials
Abstract: Huge challenges remain regarding the facile fabrication of neat metallic nanowires mesh for high-quality transparent conductors (TCs). Here, a scalable metallic nanowires bundle micromesh is achieved readily by a spray-assisted self-assembly process, resulting in a conducting mesh with controllable ring size (4-45 µm) that can be easily realized on optional polymer substrates, rendering it transferable to various deformable and transparent substrates. The resultant conductors with the embedded nanowires bundle micromesh deliver superior and customizable optoelectronic performances, and can sustain various mechanical deformations, environmental exposure, and severe washing, exhibiting feasibility for large-scale manufacturing. The silver nanowires bundle micromesh with explicit conductive paths is embedded into an ethyl cellulose (EC) transparent substrate to achieve superior optoelectronic properties endowed by a low amount of incorporated nanowires, which leads to reduced extinction cross-section as verified by optical simulation. A representative EC conductor with a low sheet resistance of 25 Ω □-1 , ultrahigh transmittance of 97%, and low haze of 2.6% is attained, with extreme deformability (internal bending radius of 5 µm) and waterproofing properties, opening up new possibilities for low-cost and scalable TCs to replace indium-tin oxide (ITO) for future flexible electronics, as demonstrated in a capacitive touch panel in this work.
URI: https://hdl.handle.net/10356/138885
ISSN: 0935-9648
DOI: 10.1002/adma.201802803
Rights: © 2018 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim. All rights reserved. This paper was published in Advanced Materials and is made available with permission of WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.
Fulltext Permission: none
Fulltext Availability: No Fulltext
Appears in Collections:MSE Journal Articles

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