Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/139549
Title: Thickness effect of nickel oxide thin films on associated solution-processed write-once-read-many-times memory devices
Authors: Wang, Xiao Lin
Liu, Zhen
Wen, Chao
Liu, Yang
Wang, Hong Zhe
Chen, Tu Pei
Zhang, Hai Yan
Keywords: Engineering::Electrical and electronic engineering
Issue Date: 2018
Source: Wang, X. L., Liu, Z., Wen, C., Liu, Y., Wang, H. Z., Chen, T. P., & Zhang, H. Y. (2018). Thickness effect of nickel oxide thin films on associated solution-processed write-once-read-many-times memory devices. Applied Physics A: Materials Science and Processing, 124, 454-. doi:10.1007/s00339-018-1868-y
Journal: Applied Physics A: Materials Science and Processing
Abstract: With self-prepared nickel acetate based solution, NiO thin films with different thicknesses have been fabricated by spin coating followed by thermal annealing. By forming a two-terminal Ag/NiO/ITO structure on glass, write-once-read-many-times (WORM) memory devices are realized. The WORM memory behavior is based on a permanent switching from an initial high-resistance state (HRS) to an irreversible low-resistance state (LRS) under the application of a writing voltage, due to the formation of a solid bridge across Ag and ITO electrodes by conductive filaments (CFs). The memory performance is investigated as a function of the NiO film thickness, which is determined by the number of spin-coated NiO layers. For devices with 4 and 6 NiO layers, data retention up to 104 s and endurance of 103 reading operations in the measurement range have been obtained with memory window maintained above four orders for both HRS and LRS. Before and after writing, the devices show the hopping and ohmic conduction behaviors, respectively, confirming that the CF formation could be the mechanism responsible for writing in the WORM memory devices.
URI: https://hdl.handle.net/10356/139549
ISSN: 0947-8396
DOI: 10.1007/s00339-018-1868-y
Schools: School of Electrical and Electronic Engineering 
Rights: © 2018 Springer-Verlag GmbH Germany, part of Springer Nature. This is a post-peer-review, pre-copyedit version of an article published in Applied Physics A: Materials Science and Processing. The final authenticated version is available online at: http://dx.doi.org/10.1007/s00339-018-1868-y
Fulltext Permission: none
Fulltext Availability: No Fulltext
Appears in Collections:EEE Journal Articles

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