Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/140149
Title: EEE bond : an Android-based mobile application for better bonding among juniors and seniors
Authors: Tey, Zhi Yong
Keywords: Engineering::Electrical and electronic engineering::Computer hardware, software and systems
Issue Date: 2020
Publisher: Nanyang Technological University
Project: A3204-191
Abstract: With the trend in technology advancement, mobile applications in the market have offered abundant of features to suit individuals and organizations’ needs, hence phone users are spending more time using their phones. In this project, a mobile application is proposed and developed to provide a social based mobile application to better connect the students in the same faculty. The application allows students to look for seniors and juniors and sending buddy request while having updates of school events. The design and development process of the application are outlined in this report. The main programming languages applied in the project are Java, XML and Javascript. Firebase is used for data storage and management purposes. The application provides essential sets of features to work seamlessly. Further implementation can be further investigate to for more potential use of the application while improving its efficiency.
URI: https://hdl.handle.net/10356/140149
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:EEE Student Reports (FYP/IA/PA/PI)

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