Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/141461
Title: Synergistic integrated design of an electrochemical mechanical polishing end-effector for robotic polishing applications
Authors: Abd El Khalick Mohammad
Hong, Jie
Wang, Danwei
Guan, Yisheng
Keywords: Engineering::Electrical and electronic engineering
Issue Date: 2018
Source: Abd El Khalick Mohammad, Hong, J., Wang, D., & Guan, Y. (2019). Synergistic integrated design of an electrochemical mechanical polishing end-effector for robotic polishing applications. Robotics and Computer-Integrated Manufacturing, 55, 65-75. doi:10.1016/j.rcim.2018.07.005
Journal: Robotics and Computer-Integrated Manufacturing
Abstract: In this paper, we present a novel design of a robotic electrochemical mechanical polishing (ECMP) process. Firstly, the process is presented to replace the conventional ECMP process by a robotic-based one. The advantage of using industrial robots lies in their flexibility, reconfigurability, large workspace and low prices compared to the conventional systems. Secondly, a novel design of a force-controlled end-effector for this purpose is presented. The end-effector is integrated into a macro-mini robot polishing cell. The macro robot (an industrial robotic manipulator) is used to position the mini robot (the proposed end-effector) according to the workpiece profile while the mini robot controls the polishing force. The effectiveness of the proposed device to polish un-milled and milled surfaces has been examined through polishing experiments. The results demonstrate the effectiveness of the presented device to reduce the surface roughness and improve the reflectability and appearance.
URI: https://hdl.handle.net/10356/141461
ISSN: 0736-5845
DOI: 10.1016/j.rcim.2018.07.005
Rights: © 2018 Elsevier Ltd. All rights reserved.
Fulltext Permission: none
Fulltext Availability: No Fulltext
Appears in Collections:EEE Journal Articles

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