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Title: Packaging & instrumentation data acquisition
Authors: Ng, Jun Tian
Keywords: Engineering::Mechanical engineering
Issue Date: 2020
Publisher: Nanyang Technological University
Project: IDFYP/19/012/5
Abstract: This project aims to set up and develop a comprehensive methodology of testing and quantifying the Seebeck Coefficient of samples of various physical compositions. This sub-project focuses on the physical components of said project such as the sample holder, sensor holder and integrated testing platform. This sub-project addresses the thought process behind the testing platform as well as the CAD drawing followed by the manufacturing process of the components. The fabricated parts were tested as individual components followed by an entire system. The fabricated parts underwent testing to justify their physical properties as well as to meet the requirements of the overall project. Various materials were tested in the multiple iterations of the components to arrive at the best suited materials for the task at hand. The overall project had tests conducted to conclude that the relevant data were able to be retrieved to calculate the Seebeck Coefficient of the supplied testing sample with varying accuracy. The temperature control was also found to be enough to maintain the required temperature for testing across a range of temperature. Finally, the limitations and recommendations for future usage and improvements of this project were discussed.
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Student Reports (FYP/IA/PA/PI)

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