Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/142210
Title: Local large-margin multi-metric learning for face and kinship verification
Authors: Hu, Junlin
Lu, Jiwen
Tan, Yap-Peng
Yuan, Junsong
Zhou, Jie
Keywords: Engineering::Electrical and electronic engineering
Issue Date: 2017
Source: Hu, J., Lu, J., Tan, Y.-P., Yuan, J., & Zhou, J. (2018). Local large-margin multi-metric learning for face and kinship verification. IEEE Transactions on Circuits and Systems for Video Technology, 28(8), 1875-1891. doi:10.1109/TCSVT.2017.2691801
Journal: IEEE Transactions on Circuits and Systems for Video Technology
Abstract: Metric learning has attracted wide attention in face and kinship verification, and a number of such algorithms have been presented over the past few years. However, most existing metric learning methods learn only one Mahalanobis distance metric from a single feature representation for each face image and cannot make use of multiple feature representations directly. In many face-related tasks, we can easily extract multiple features for a face image to extract more complementary information, and it is desirable to learn distance metrics from these multiple features, so that more discriminative information can be exploited than those learned from individual features. To achieve this, we present a large-margin multi-metric learning (LM3L) method for face and kinship verification, which jointly learns multiple global distance metrics under which the correlations of different feature representations of each sample are maximized, and the distance of each positive pair is less than a low threshold and that of each negative pair is greater than a high threshold. To better exploit the local structures of face images, we also propose a local metric learning and local LM3Lmethods to learn a set of local metrics. Experimental results on three face data sets show that the proposed methods achieve very competitive results compared with the state-of-the-art methods.
URI: https://hdl.handle.net/10356/142210
ISSN: 1051-8215
DOI: 10.1109/TCSVT.2017.2691801
Rights: © 2017 IEEE. All rights reserved.
Fulltext Permission: none
Fulltext Availability: No Fulltext
Appears in Collections:EEE Journal Articles

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