Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/142236
Title: Oxide thin-film transistor-based vertically stacked complementary inverter for logic and photo-sensor operations
Authors: Joo, Hyo-Jun
Shin, Min-Gyu
Jung, Hwan-Seok
Cha, Hyun-Seok
Nam, Donguk
Kwon, Hyuck-In
Keywords: Engineering::Electrical and electronic engineering
Issue Date: 2019
Source: Joo, H.-J., Shin, M.-G., Jung, H.-S., Cha, H.-S., Nam, D. & Kwon., H.-I. (2019). Oxide thin-film transistor-based vertically stacked complementary inverter for logic and photo-sensor operations. Materials, 12(23), 3815-. doi:10.3390/ma12233815
Journal: Materials
Abstract: Numerous studies have addressed the utilization of oxide thin-film transistor (TFT)-based complementary logic circuits that are based on two-dimensional (2D) planar structures. However, there are fundamental limits to the 2D planar structured complementary logic circuits, such as a large dimension and a large parasitic resistance. This work demonstrated a vertically stacked three-dimensional complementary inverter composed of a p-channel tin monoxide (SnO) TFT and an n-channel indium-gallium-zinc oxide (IGZO) TFT. A bottom-gate p-channel SnO TFT was formed on the top-gate n-channel IGZO TFT with a shared common gate electrode. The fabricated vertically stacked complementary inverter exhibited full swing characteristics with a voltage gain of ~33.6, a high noise margin of 3.13 V, and a low noise margin of 3.16 V at a supplied voltage of 10 V. The achieved voltage gain of the fabricated complementary inverter was higher than that of the vertically stacked complementary inverters composed of other oxide TFTs in previous works. In addition, we showed that the vertically stacked complementary inverter exhibited excellent visible-light photoresponse. This indicates that the oxide TFT-based vertically stacked complementary inverter can be used as a sensitive photo-sensor operating in the visible spectral range with the voltage read-out scheme.
URI: https://hdl.handle.net/10356/142236
ISSN: 1996-1944
DOI: 10.3390/ma12233815
Schools: School of Electrical and Electronic Engineering 
Rights: © 2019 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:EEE Journal Articles

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