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Title: Two-photon-assisted polymerization and reduction : emerging formulations and applications
Authors: Lay, Chee Leng
Koh, Charlynn Sher Lin
Lee, Yih Hong
Phan-Quang, Gia Chuong
Sim, Howard Yi Fan
Leong, Shi Xuan
Han, Xuemei
Phang, In Yee
Ling, Xing Yi
Keywords: Science::Physics
Issue Date: 2020
Source: Lay, C. L., Koh, C. S. L., Lee, Y. H., Phan-Quang, G. C., Sim, H. Y. F., Leong, S. X., ... Ling, X. Y. (2020). Two-photon-assisted polymerization and reduction : emerging formulations and applications. ACS Applied Materials & Interfaces, 12(9), 10061-10079. doi:10.1021/acsami.9b20911
Journal: ACS Applied Materials & Interfaces
Abstract: Two-photon lithography (TPL) is an emerging approach to fabricate complex multifunctional micro/nanostructures. This is because TPL can easily develop various 2D and 3D structures on a variety of surfaces, and there has been a rapidly expanding pool of processable photoresists to create different materials. However, challenges in developing two-photon processable photoresists currently impede progress in TPL. In this review, we critically discuss the importance of photoresist formulation in TPL. We begin by evaluating the commercial photoresists to design micro/nanostructures for promising applications in anti-counterfeiting, superomniphobicity, and micromachines with movable parts. Next, we discuss emerging hydrogel/organogel photoresists, focusing on customizing photoresist formulations to fabricate reconfigurable structures that can respond to changes in local pH, solvent, and temperature. We also review the development of metal salt-based photoresists for direct metal writing, whereby various formulations have been developed to enable applications in online sensing, catalysis, and electronics. Finally, we provide a critical outlook and highlight various outstanding challenges in formulating processable photoresists for TPL.
ISSN: 1944-8244
DOI: 10.1021/acsami.9b20911
Rights: This document is the Accepted Manuscript version of a Published Work that appeared in final form in ACS Applied Materials & Interfaces, copyright © American Chemical Society after peer review and technical editing by the publisher. To access the final edited and published work see
Fulltext Permission: embargo_20210311
Fulltext Availability: With Fulltext
Appears in Collections:SPMS Journal Articles

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