Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/143489
Title: Decapsulation of 3D multi-die stacked package
Authors: Kor, Katherine Hwee Boon
Liu, Q.
Siah, Yu Wen
Gan, Chee Lip
Keywords: Engineering::Materials
Issue Date: 2015
Source: Kor, K. H. B., Liu, Q., Siah, Y. W., & Gan, C. L. (2015). Decapsulation of 3D multi-die stacked package. 2015 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, 465-468. doi:10.1109/IPFA.2015.7224433
Abstract: Although a combination of laser, mechanical and chemical techniques can be used to expose a very large and thin die from a multi-die stacked package, package warping and die crack occur in the process of gaining access to each die. The aim of this paper is to investigate the sample preparation technique to access each individual die from a four-die stacked package, while maintaining the structural integrity of each die for further failure analysis.
URI: https://hdl.handle.net/10356/143489
ISBN: 9781479999286
DOI: 10.1109/IPFA.2015.7224433
Rights: © 2015 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other users, in any current or future media, including reprinting/republishing this material for adverstising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. The published version is available at:https://doi.org/10.1109/IPFA.2015.7224433
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:TL Conference Papers

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