Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/143510
Title: Uniform delayering of copper metallization
Authors: Siah, Yu Wen
Hong, Y. J.
Liu, Q.
Kor, Katherine Hwee Boon
Gan, C. L.
Keywords: Engineering::Materials
Issue Date: 2013
Source: Siah, Y. W., Hong, Y. J., Liu, Q., Kor, K. H. B., & Gan, C. L. (2013). Uniform delayering of copper metallization. 2013 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, 166-169. doi:10.1109/IPFA.2013.6599147
Abstract: Integrated circuit chips of newer technology usually have a larger die size and an increase number of metallization. Hence, pure usage of polishing to remove the layers would induce severe edge rounding. An alternative method is proposed to decrease the polishing time for copper metallization removal while reducing edge rounding on the sample during sample preparation that will preserve the integrity of the layers for further failure analysis.
URI: https://hdl.handle.net/10356/143510
ISBN: 9781479912414
DOI: 10.1109/IPFA.2013.6599147
Rights: © 2013 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other users, in any current or future media, including reprinting/republishing this material for adverstising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. The published version is available at:https://doi.org/10.1109/IPFA.2013.6599147
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:TL Conference Papers

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