Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/143809
Title: Efficient approach to scheduling of transient processes for time-constrained single-arm cluster tools with parallel chambers
Authors: Yang, Fajun
Qiao, Yan
Gao, Kaizhou
Wu, Naiqi
Zhu, Yuting
Ware, Simon Ian
Su, Rong
Keywords: Engineering::Electrical and electronic engineering
Issue Date: 2020
Source: Yang, F., Qiao, Y., Gao, K., Wu, N., Zhu, Y., Ware, S. I., & Su, R. (2018). Efficient approach to scheduling of transient processes for time-constrained single-arm cluster tools with parallel chambers. IEEE Transactions on Systems, Man, and Cybernetics: Systems, 50(10), 3646-3657. doi:10.1109/tsmc.2018.2852724
Journal: IEEE Transactions on Systems, Man, and Cybernetics: Systems
Abstract: In wafer manufacturing, extensive research on the operations of cluster tools under the steady state has been reported. However, with the shrinking down of wafer lot size, such tools are frequently required to switch from handling one lot of wafers to another, resulting in more transient processes, including start-up and close-down ones. Also, wafer residency time constraint is critical for many wafer fabrication processes. To cope with the transient scheduling problem of time-constrained single-arm cluster tools with parallel chambers, based on a generalized backward strategy, this paper first builds timed Petri net models for these two transient processes. Then, two linear programs are derived for the first time to search a feasible schedule with a minimal makespan. Two industrial examples are given to demonstrate the effectiveness of the obtained results at last.
URI: https://hdl.handle.net/10356/143809
ISSN: 2168-2216
DOI: 10.1109/TSMC.2018.2852724
Rights: © 2018 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. The published version is available at: https://doi.org/10.1109/TSMC.2018.2852724
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:EEE Journal Articles

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