Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/143956
Title: Novel timed and self-resistive heating shape memory polymer hybrid for large area and energy efficient application
Authors: Loeblein, Manuela
Bolker, Asaf
Ngoh, Zhi Lin
Li, Lanxin
Wallach, Eliana
Tsang, Siu Hon
Pawlik, Matthieu
Verker, Ronen
Atar, Nurit
Gouzman, Irina
Teo, Edwin Hang Tong
Keywords: Engineering::Electrical and electronic engineering
Issue Date: 2018
Source: Loeblein, M., Bolker, A., Ngoh, Z. L., Li, L., Wallach, E., Tsang, S. H., ... Teo, E. H. T. (2018). Novel timed and self-resistive heating shape memory polymer hybrid for large area and energy efficient application. Carbon, 139, 626-634. doi:10.1016/j.carbon.2018.07.018.
Journal: Carbon
Abstract: Shape memory polymers (SMPs) are a polymeric smart material that can register two or more temporary shapes and transform to one another through an external stimulus. Despite their compactness and customizability, SMPs haven't been able to be adopted for mainstream applications. Since the majority of SMPs are triggered by heat, and SMPs have a very poor thermal conductivity, large thermal gradients within the polymer appear which cause slow response, inhomogeneous heat distribution and thus non-uniform transformation of shapes and cracks. Many have attempted to improve their thermal performance through the incorporation of filler-based nanomaterials. However, the outcome is ineffective as the spatial dispersion of fillers within the SMP is inhomogeneous and leads to performance loss. Contrastingly, the herein presented new class of nanocomposite-SMP, composed by 3D-foam fillers, showcase a much more efficient SMP adaptable to larger area with faster transformation speed and without any performance loss. Furthermore, the improved thermal properties lead to a decrease in required input energy, as well as render the SMP a self-heating capability which can be further designed into timed multi-step SMP behavior.
URI: https://hdl.handle.net/10356/143956
ISSN: 0008-6223
DOI: 10.1016/j.carbon.2018.07.018
Schools: School of Electrical and Electronic Engineering 
Research Centres: Temasek Laboratories 
Rights: © 2018 Published by Elsevier Ltd. All rights reserved.
Fulltext Permission: none
Fulltext Availability: No Fulltext
Appears in Collections:EEE Journal Articles

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