Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/144526
Title: Reliability- and cost-based redundancy design for modular multilevel converter
Authors: Tu, Pengfei
Yang, Shunfeng
Wang, Peng
Keywords: Engineering::Electrical and electronic engineering
Issue Date: 2018
Source: Tu, P., Yang, S., & Wang, P. (2019). Reliability- and cost-based redundancy design for modular multilevel converter. IEEE Transactions on Industrial Electronics, 66(3), 2333-2342. doi:10.1109/TIE.2018.2793263
Journal: IEEE Transactions on Industrial Electronics
Abstract: The modular multilevel converter (MMC) is very attractive in a high-voltage dc (HVdc) transmission system due to its high modularity and scalability. It is also a promising candidate for medium-voltage applications. An MMC has many power devices that lead to a relatively low reliability based only on a direct failure rate calculation. The reliability of an MMC can be improved by redundant designs. Lots of redundant designs and strategies have been proposed in recent years, while their reliability improvements are hardly quantified in existing literature. In practice, reliability improvement with constraint costs is a challenge. In view of these, this paper proposes a reliability and cost assessment scheme for MMC redundant designs and strategies. Reliability and cost are quantified for comparison purposes. A medium-voltage application is used to demonstrate the reliability and cost assessment scheme. The reliability analysis is based on a combinatorial model and the Poisson process model. The cost analysis focuses on capital cost and power loss cost. The proposed reliability and cost analysis scheme provides a guideline for MMC redundant design and redundant strategy selection.
URI: https://hdl.handle.net/10356/144526
ISSN: 0278-0046
DOI: 10.1109/TIE.2018.2793263
Rights: © 2018 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. The published version is available at: https://doi.org/10.1109/TIE.2018.2793263
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:EEE Journal Articles

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