Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/144603
Title: Elastic strain engineering of group IV materials for low-threshold on-chip lasers
Authors: Nam, Donguk
Keywords: Engineering::Electrical and electronic engineering
Issue Date: 2018
Source: Nam, D. (2018). Elastic strain engineering of group IV materials for low-threshold on-chip lasers. Proceedings of the 2018 International Conference on Solid State Devices and Materials (SSDM). Tokyo, Japan.
Project: RG 179/17 
Conference: 2018 International Conference on Solid State Devices and Materials (SSDM)
Abstract: In this talk, we discuss our recent efforts on the development of strain-engineered group IV lasers for their use in photonic-integrated circuits.
URI: https://confit.atlas.jp/guide/event/ssdm2018/subject/H-1-01/detail?lang=en
https://hdl.handle.net/10356/144603
Schools: School of Electrical and Electronic Engineering 
Rights: © 2018 The Japan Society of Applied Physics. All rights reserved. This paper was published in Proceedings of the 2018 International Conference on Solid State Devices and Materials (SSDM) and is made available with permission of The Japan Society of Applied Physics.
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:EEE Conference Papers

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