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Title: Sample preparation for deprocessing of 3D multi-die stacked package
Authors: Kor, Katherine Hwee Boon
Liu, Q.
Gan, Chee Lip
Keywords: Engineering::Materials
Issue Date: 2020
Source: Kor, K. H. B., Liu, Q., & Gan, C. L. (2020). Sample preparation for deprocessing of 3D multi-die stacked package. Proceedings of the IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), 1-6. doi:10.1109/IPFA49335.2020.9260707
Abstract: 3D packaging consists of a variety of architectures and types. Fault isolation and physical failure analysis (PFA) can involve non-destructive and destructive techniques. Previously, decapsulation techniques to gain access to individual dice in a 3D multi-die stacked package with very thin dice (100 µm) had been investigated. This paper introduces the sample preparation techniques required for the deprocessing of a thin die within the 3D multi-die stacked package.
ISBN: 978-1-7281-6169-3
DOI: 10.1109/IPFA49335.2020.9260707
Rights: © 2020 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. The published version is available at:
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:TL Conference Papers

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