Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/145285
Title: Routing in optical network-on-chip : minimizing contention with guaranteed thermal reliability
Authors: Li, Mengquan
Liu, Weichen
Yang, Lei
Chen, Peng
Liu, Duo
Guan, Nan
Keywords: Engineering::Computer science and engineering
Issue Date: 2019
Source: Li, M., Liu, W., Yang, L., Chen, P., Liu, D., & Guan, N. (2019). Routing in optical network-on-chip : minimizing contention with guaranteed thermal reliability. Proceedings of the 24th Asia and South Pacific Design Automation Conference, 364-369. doi:10.1145/3287624.3287650
Abstract: Communication contention and thermal susceptibility are two potential issues in optical network-on-chip (ONoC) architecture, which are both critical for ONoC designs. However, minimizing conflict and guaranteeing thermal reliability are incompatible in most cases. In this paper, we present a routing criterion in the network level. Combined with device-level thermal tuning, it can implement thermal-reliable ONoC. We further propose two routing approaches (including a mixed-integer linear programming (MILP) model and a heuristic algorithm (CAR)) to minimize communication conflict based on the guaranteed thermal reliability, and meanwhile, mitigate the energy overheads of thermal regulation in the presence of chip thermal variations. By applying the criterion, our approaches achieve excellent performance with largely reduced complexity of design space exploration. Evaluation results on synthetic communication traces and realistic benchmarks show that the MILP-based approach achieves an average of 112.73% improvement in communication performance and 4.18% reduction in energy overhead compared to state-of-the-art techniques. Our heuristic algorithm only introduces 4.40% performance difference compared to the optimal results and is more scalable to large-size ONoCs.
URI: https://hdl.handle.net/10356/145285
DOI: 10.1145/3287624.3287650
Rights: © 2019 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. The published version is available at: https://doi.org/10.1145/3287624.3287650
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:SCSE Conference Papers

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