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Title: Lightweight thermal monitoring in optical networks-on-chip via router reuse
Authors: Li, Mengquan
Zhou, Jun
Liu, Weichen
Keywords: Engineering::Computer science and engineering
Issue Date: 2020
Source: Li, M., Zhou, J., & Liu, W. (2020). Lightweight thermal monitoring in optical networks-on-chip via router reuse. Proceedings of the Design, Automation & Test in Europe Conference & Exhibition (DATE), 406-411. doi:10.23919/DATE48585.2020.9116351
Abstract: Optical network-on-chip (ONoC) is an emerging communication architecture for manycore systems due to low latency, high bandwidth, and low power dissipation. However, a major concern lies in its thermal susceptibility - under onchip temperature variations, functional nanophotonic devices, especially microring resonator (MR)-based devices, suffer from significant thermal-induced optical power loss, which potentially counteracts the power advantages of ONoCs and even cause functional failures. Considering the fact that temperature gradients are typically found on many-core systems, effective thermal monitoring, performing as the foundation of thermal-aware management, is critical on ONoCs. In this paper, a lightweight thermal monitoring scheme is proposed for ONoCs. We first design a temperature measurement module based on generic optical routers. It introduces trivial overheads in chip area by reusing the components in routers. A major problem with reusing optical routers is that it may potentially interfere with the normal communications in ONoCs. To address it, we then propose a time allocation strategy to schedule thermal sensing operations in the time intervals between communications. Evaluation results show that our scheme exhibits an untrimmed inaccuracy of 1.0070 K with low energy consumption of 656.38 pJ/Sa. It occupies an extremely small area of 0.0020 mm 2 , reducing the area cost by 83.74% on average compared to the state-of-the-art optical thermal sensor design.
DOI: 10.23919/DATE48585.2020.9116351
Rights: © 2020 European Design and Automation Association (EDAA). All rights reserved. This paper was published in 2019 Design, Automation & Test in Europe Conference & Exhibition (DATE) and is made available with permission of European Design and Automation Association (EDAA).
Fulltext Permission: embargo_20220622
Fulltext Availability: With Fulltext
Appears in Collections:SCSE Conference Papers

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