Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/145382
Title: A post-treatment method to enhance the property of aerosol jet printed electric circuit on 3D printed substrate
Authors: Wang, Bing
Zhang, Haining
Choi, Joon Phil
Moon, Seung Ki
Lee, Byunghoon
Koo, Jamyeong
Keywords: Engineering
Issue Date: 2020
Source: Wang, B., Zhang, H., Choi, J. P., Moon, S. K., Lee, B., & Koo, J. (2020). A post-treatment method to enhance the property of aerosol jet printed electric circuit on 3D printed substrate. Materials, 13(24), 5602- . doi:10.3390/ma13245602
Journal: Materials 
Abstract: Aerosol jet printing of electronic devices is increasingly attracting interest in recent years. However, low capability and high resistance are still limitations of the printed electronic devices. In this paper, we introduce a novel post-treatment method to achieve a high-performance electric circuit. The electric circuit was printed with aerosol jet printing method on an ULTEM substrate. The ULTEM substrate was fabricated by the Fused Deposition Modelling method. After post-treatment, the electrical resistance of the printed electric circuit was changed from 236 mΩ to 47 mΩ and the electric property was enhanced. It was found that the reduction of electric resistance was caused by surface property changes. Different surface analysis methods including scanning electron microscopy (SEM) and x-ray photoelectron spectroscopy (XPS) were used to understand the effectiveness of the proposed method. The results showed that the microsurface structure remained the same original structure before and after treatment. It was found that the surface carbon concentration was significantly increased after treatment. Detailed analysis showed that the C-C bond increased obviously after treatment. The change of electrical resistance was found to be limited to the material's surface. After polishing, the circuit resistance was changed back to its original value. As the electric circuit is the basic element of electric devices, the proposed method enables the fabrication of high performance devices such as capacitors, strain gauge, and other sensors, which has potential applications in many areas such as industrial, aerospace, and military usage.
URI: https://hdl.handle.net/10356/145382
ISSN: 1996-1944
DOI: 10.3390/ma13245602
Schools: School of Mechanical and Aerospace Engineering 
Research Centres: Singapore Centre for 3D Printing 
Rights: © 2020 by the Authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:SC3DP Journal Articles

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