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Title: Exploring thermoelectric property improvement for binary copper chalcogenides
Authors: Chen, Xinqi
Yang, Jianping
Katkus, Tomas
Wu, Tian
Tao, Junhui
Li, Jie
Wang, Chuanhui
Wang, Xin
Dai, Wei
Keywords: Engineering::Materials
Issue Date: 2020
Source: Chen, X., Yang, J., Katkus, T., Wu, T., Tao, J., Li, J., . . . Dai, W. (2020). Exploring thermoelectric property improvement for binary copper chalcogenides. Frontiers in Materials, 7, 589568-. doi:10.3389/fmats.2020.589568
Journal: Frontiers in Materials 
Abstract: Copper chalcogenides have been the subject of extensive research as promising candidates in thermoelectric conversion applications due to their advantageous properties, environmental compatibility, and abundance. The low intrinsic thermal conductivity and high electric conductivity of these materials are born out of the “phonon-liquid electron-crystal” structure between the copper and chalcogens. In this review, strategies for thermoelectric property improvement of copper chalcogenides are discussed. The challenges and the future development of binary copper chalcogenides for further thermoelectric conversion applications are outlined.
ISSN: 2296-8016
DOI: 10.3389/fmats.2020.589568
Schools: School of Chemical and Biomedical Engineering 
Rights: © 2020 Chen, Yang, Katkus, Wu, Tao, Li, Wang, Wang and Dai. This is an open-access article distributed under the terms of the Creative Commons Attribution License (CC BY). The use, distribution or reproduction in other forums is permitted, provided the original author(s) and the copyright owner(s) are credited and that the original publication in this journal is cited, in accordance with accepted academic practice. No use, distribution or reproduction is permitted which does not comply with these terms.
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:SCBE Journal Articles

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