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dc.contributor.authorChen, Xinqien_US
dc.contributor.authorYang, Jianpingen_US
dc.contributor.authorKatkus, Tomasen_US
dc.contributor.authorWu, Tianen_US
dc.contributor.authorTao, Junhuien_US
dc.contributor.authorLi, Jieen_US
dc.contributor.authorWang, Chuanhuien_US
dc.contributor.authorWang, Xinen_US
dc.contributor.authorDai, Weien_US
dc.identifier.citationChen, X., Yang, J., Katkus, T., Wu, T., Tao, J., Li, J., . . . Dai, W. (2020). Exploring thermoelectric property improvement for binary copper chalcogenides. Frontiers in Materials, 7, 589568-. doi:10.3389/fmats.2020.589568en_US
dc.description.abstractCopper chalcogenides have been the subject of extensive research as promising candidates in thermoelectric conversion applications due to their advantageous properties, environmental compatibility, and abundance. The low intrinsic thermal conductivity and high electric conductivity of these materials are born out of the “phonon-liquid electron-crystal” structure between the copper and chalcogens. In this review, strategies for thermoelectric property improvement of copper chalcogenides are discussed. The challenges and the future development of binary copper chalcogenides for further thermoelectric conversion applications are outlined.en_US
dc.relation.ispartofFrontiers in Materialsen_US
dc.rights© 2020 Chen, Yang, Katkus, Wu, Tao, Li, Wang, Wang and Dai. This is an open-access article distributed under the terms of the Creative Commons Attribution License (CC BY). The use, distribution or reproduction in other forums is permitted, provided the original author(s) and the copyright owner(s) are credited and that the original publication in this journal is cited, in accordance with accepted academic practice. No use, distribution or reproduction is permitted which does not comply with these terms.en_US
dc.titleExploring thermoelectric property improvement for binary copper chalcogenidesen_US
dc.typeJournal Articleen
dc.contributor.schoolSchool of Chemical and Biomedical Engineeringen_US
dc.description.versionPublished versionen_US
dc.subject.keywordsThermoelectric Propertyen_US
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