Please use this identifier to cite or link to this item:
Title: A study of wireless inter-chip interconnect
Authors: Chen, Zhiming
Keywords: DRNTU::Engineering::Electrical and electronic engineering::Antennas, wave guides, microwaves, radar, radio
DRNTU::Engineering::Electrical and electronic engineering::Electronic circuits
Issue Date: 2008
Source: Chen, Z. (2008). A study of wireless inter-chip interconnect. Doctoral thesis, Nanyang Technological University, Singapore.
Abstract: In semiconductor industry, device feature dimension has been continuously scaled down to reduce device size and to improve circuit performance. In parallel with the device feature dimension down scaling, the width and thickness of wire interconnect have been reduced. On the other hand, to integrate more functions together, chip size continues growing. Therefore, the down-scaled wire interconnect has to route over an ever increasing chip area, implying degraded interconnect performance. As a matter of fact, performance of interconnects rather than device has become a bottleneck of ICs system performance. With improved radio frequency silicon technologies and higher-degree integration, wireless interconnect, which realizes wireless communications among cores within a chip or different chips within a module, is a viable candidate for solving problems in future generations of interconnects.
DOI: 10.32657/10356/14559
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:EEE Theses

Files in This Item:
File Description SizeFormat 
Teee0402873g.pdf2.36 MBAdobe PDFThumbnail

Page view(s) 50

Updated on May 13, 2021

Download(s) 20

Updated on May 13, 2021

Google ScholarTM




Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.