Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/145793
Title: Modelling and parameter optimization for filament deformation in 3D cementitious material printing using support vector machine
Authors: Liu, Zhixin
Li, Mingyang
Weng, Yiwei
Qian, Ye
Wong, Teck Neng
Tan, Ming Jen
Keywords: Engineering::Mechanical engineering
Issue Date: 2020
Source: Liu, Z., Li, M., Weng, Y., Qian, Y., Wong, T. N., & Tan, M. J. (2020). Modelling and parameter optimization for filament deformation in 3D cementitious material printing using support vector machine. Composites Part B: Engineering, 193, 108018-. doi:10.1016/j.compositesb.2020.108
Journal: Composites Part B: Engineering 
Abstract: The material flow mechanism affects the printing quality considerably in 3D cementitious material printing (3DCMP) area. A numerical model was developed to investigate the material flow mechanism during the extrusion and deposition process. To quantify the effects of flow mechanism on the filament printing quality, deformation of the printed filament was proposed. Then a Support Vector Machine (SVM) was employed to study various factors on flow mechanism, hence the deformation of the printed filament. The SVM model results showed that deformation of the printed filament is independent of plastic viscosity, however, material yield stress and relative nozzle travel speed significantly affect the deformation of the printed filament. Lastly, an empirical parametric associative model was proposed to predict the filament deformation based on material yield stress and relative nozzle travel speed.
URI: https://hdl.handle.net/10356/145793
ISSN: 1359-8368
DOI: 10.1016/j.compositesb.2020.108018
Schools: School of Mechanical and Aerospace Engineering 
Research Centres: Singapore Centre for 3D Printing 
Rights: © 2020 Elsevier Ltd. All rights reserved. This paper was published in Composites Part B: Engineering and is made available with permission of Elsevier Ltd.
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:SC3DP Journal Articles

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