Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/146291
Title: Development of a CMOs-compatible carbon nanotube array transfer method
Authors: Siah, Chun Fei
Lum, Lucas Yu Xiang
Wang, Jianxiong
Goh, Simon Chun Kiat
Tan, Chong Wei
Hu, Liangxing
Coquet, Philippe
Li, Hong 
Tan, Chuan Seng
Tay, Beng Kang
Keywords: Engineering
Issue Date: 2021
Source: Siah, C. F., Lum, L. Y. X., Wang, J., Goh, S. C. K., Tan, C. W., Hu, L., ... Tay, B. K. (2021). Development of a CMOs-compatible carbon nanotube array transfer method. Micromachines, 12(1). doi:10.3390/mi12010095
Journal: Micromachines 
Abstract: Carbon nanotubes (CNTs) have, over the years, been used in research as a promising material in electronics as a thermal interface material and as interconnects amongst other applications. However, there exist several issues preventing the widespread integration of CNTs onto device applications, e.g., high growth temperature and interfacial resistance. To overcome these issues, a complementary metal oxide semiconductor (CMOS)-compatible CNT array transfer method that electrically connects the CNT arrays to target device substrates was developed. The method separates the CNT growth and preparation steps from the target substrate. Utilizing an alignment tool with the capabilities of thermocompression enables a highly accurate transfer of CNT arrays onto designated areas with desired patterns. With this transfer process as a starting point, improvement pointers are also discussed in this paper to further improve the quality of the transferred CNTs.
URI: https://hdl.handle.net/10356/146291
ISSN: 2072-666X
DOI: 10.3390/mi12010095
Schools: School of Electrical and Electronic Engineering 
School of Mechanical and Aerospace Engineering 
Organisations: Institut d’Electronique, de Micro Electronique et de Nanotechnologie
Research Centres: CNRS International NTU THALES Research Alliances 
Rights: © 2021 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:EEE Journal Articles

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