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dc.contributor.authorSiah, Chun Feien_US
dc.contributor.authorLum, Lucas Yu Xiangen_US
dc.contributor.authorWang, Jianxiongen_US
dc.contributor.authorGoh, Simon Chun Kiaten_US
dc.contributor.authorTan, Chong Weien_US
dc.contributor.authorHu, Liangxingen_US
dc.contributor.authorCoquet, Philippeen_US
dc.contributor.authorLi, Hongen_US
dc.contributor.authorTan, Chuan Sengen_US
dc.contributor.authorTay, Beng Kangen_US
dc.identifier.citationSiah, C. F., Lum, L. Y. X., Wang, J., Goh, S. C. K., Tan, C. W., Hu, L., ... Tay, B. K. (2021). Development of a CMOs-compatible carbon nanotube array transfer method. Micromachines, 12(1). doi:10.3390/mi12010095en_US
dc.description.abstractCarbon nanotubes (CNTs) have, over the years, been used in research as a promising material in electronics as a thermal interface material and as interconnects amongst other applications. However, there exist several issues preventing the widespread integration of CNTs onto device applications, e.g., high growth temperature and interfacial resistance. To overcome these issues, a complementary metal oxide semiconductor (CMOS)-compatible CNT array transfer method that electrically connects the CNT arrays to target device substrates was developed. The method separates the CNT growth and preparation steps from the target substrate. Utilizing an alignment tool with the capabilities of thermocompression enables a highly accurate transfer of CNT arrays onto designated areas with desired patterns. With this transfer process as a starting point, improvement pointers are also discussed in this paper to further improve the quality of the transferred CNTs.en_US
dc.description.sponsorshipMinistry of Education (MOE)en_US
dc.rights© 2021 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (
dc.titleDevelopment of a CMOs-compatible carbon nanotube array transfer methoden_US
dc.typeJournal Articleen
dc.contributor.schoolSchool of Electrical and Electronic Engineeringen_US
dc.contributor.schoolSchool of Mechanical and Aerospace Engineeringen_US
dc.contributor.organizationInstitut d’Electronique, de Micro Electronique et de Nanotechnologieen_US
dc.contributor.researchCNRS International NTU THALES Research Alliancesen_US
dc.description.versionPublished versionen_US
dc.subject.keywordsCarbon Nanotubesen_US
dc.subject.keywordsMicroelectronics Fabricationen_US
dc.description.acknowledgementThis research was funded by Singapore MOE Tier 2, MOE2018-T2-2-105 and Excelitas Technologies Singapore (EDB-IPP).en_US
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