Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/147160
Title: Ultraflexible glassy semiconductor fibers for thermal sensing and positioning
Authors: Zhang, Ting
Wang, Zhe
Srinivasan, Bhuvanesh
Wang, Zhixun
Zhang, Jing
Li, Kaiwei
Boussard-Pledel, Catherine
Troles, Johann
Bureau, Bruno
Wei, Lei
Keywords: Engineering::Electrical and electronic engineering
Issue Date: 2019
Source: Zhang, T., Wang, Z., Srinivasan, B., Wang, Z., Zhang, J., Li, K., Boussard-Pledel, C., Troles, J., Bureau, B. & Wei, L. (2019). Ultraflexible glassy semiconductor fibers for thermal sensing and positioning. ACS Applied Materials and Interfaces, 11(2), 2441-2447. https://dx.doi.org/10.1021/acsami.8b20307
Project: MOE2015-T2-1- 066
MOE2015-T2-2-010
RG85/16
M4081515: L.W
Journal: ACS Applied Materials and Interfaces
Abstract: Flexible, large-area, and low-cost thermal sensing networks with high spatial and temporal resolution are of profound importance in addressing the increasing needs for industrial processing, medical diagnosis, and military defense. Here, a thermoelectric (TE) fiber is fabricated by thermally codrawing a macroscopic preform containing a semiconducting glass core and a polymer cladding to deliver thermal sensor functionalities at fiber-optic length scales, flexibility, and uniformity. The resulting TE fiber sensor operates in a wide temperature range with high thermal detection sensitivity and accuracy, while offering ultraflexibility with the bending curvature radius below 2.5 mm. Additionally, a single TE fiber can either sense the spot temperature variation or locate the heat/cold spot on the fiber. As a proof of concept, a two-dimensional 3 × 3 fiber array is woven into a textile to simultaneously detect the temperature distribution and the position of heat/cold source with the spatial resolution of millimeter. Achieving this may lead to the realization of large-area, flexible, and wearable temperature sensing fabrics for wearable electronics and advanced artificial intelligence applications.
URI: https://hdl.handle.net/10356/147160
ISSN: 1944-8244
DOI: 10.1021/acsami.8b20307
Rights: This document is the Accepted Manuscript version of a Published Work that appeared in final form in ACS Applied Materials and Interfaces, copyright © American Chemical Society after peer review and technical editing by the publisher. To access the final edited and published work see https://doi.org/10.1021/acsami.8b20307.
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:EEE Journal Articles

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