Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/148767
Title: Emerging thermal technology enabled augmented reality
Authors: Parida, Kaushik
Bark, Hyungwoo
Lee, Pooi See
Keywords: Engineering::Materials
Issue Date: 2021
Source: Parida, K., Bark, H. & Lee, P. S. (2021). Emerging thermal technology enabled augmented reality. Advanced Functional Materials, 2007952-. https://dx.doi.org/10.1002/adfm.202007952
Project: Competitive Research Program/NRF-CRP13-2014-02
NRF Investigatorship /NRF-NRFI2016-05
Journal: Advanced Functional Materials
Abstract: In the past decade, remarkable progress has been made in the domain of augmented reality/virtual reality (AR/VR). The need for realistic and immersive augmentation has propelled the development of haptics interfaces-enabled AR/VR. The haptics interfaces facilitate direct interaction and manipulation with both real and virtual objects, thus augmenting the perception and experiences of the users. The level of augmentation can be significantly improved by thermal stimulation or sensing, which facilitates a higher degree of object identification and discrimination. This review discusses the thermal technology-enabled augmented reality and summarizes the recent progress in the development of different thermal technology such as thermal haptics including thermo-resistive heater and Peltier devices, thermal sensors including resistive, pyroelectric, and thermoelectric sensors, which can be utilized to improve the realism of augmentation. The fundamental mechanism, design strategies, and the rational guidelines for the adoption of these technologies in AR/VR is explicitly discussed. The conclusion provides an outlook on the existing challenges and outlines the future roadmap for the realization of next-generation thermo-haptics enabled augmented reality.
URI: https://hdl.handle.net/10356/148767
ISSN: 1616-3028
DOI: 10.1002/adfm.202007952
Rights: © 2021 The Authors. Advanced Functional Materials published by Wiley-VCH GmbH. This is an open access article under the terms of the Creative Commons Attribution-NonCommercial-NoDerivs License, which permits use and distribution in any medium, provided the original work is properly cited, the use is non-commercial and no modifications or adaptations are made.
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:MSE Journal Articles

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