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https://hdl.handle.net/10356/148930
Title: | Improving nanoimprinting for copper nanowire fabrication | Authors: | Loi, Jonathan Wei Chuen | Keywords: | Engineering::Mechanical engineering | Issue Date: | 2021 | Publisher: | Nanyang Technological University | Source: | Loi, J. W. C. (2021). Improving nanoimprinting for copper nanowire fabrication. Final Year Project (FYP), Nanyang Technological University, Singapore. https://hdl.handle.net/10356/148930 | Abstract: | Cost-efficient solutions to produce nanomaterials with low turnaround time are desired by manufacturing industries. This prompted research into new methods to enhance the efficiency of current processes specifically lubricants, which can reduce friction during the manufacturing process. Past research studied the inclusion of lubricants in their nanoimprinting process, which helped improve the quality and quantity of their nanostructure. However, it is unclear if this improvement can be attributed to the reduction of friction coefficient or other underlying mechanisms. In this project, it was observed that lubricants improved the nanoimprinting process, by increasing the maximum length and number of nanowires extruded. Furthermore, it is determined that four layers of lubrication is enough for sufficient lubrication, where the amount is diluted enough to not obstruct the nanoimprinting process, while being viscous enough to lubricate. The nanoimprinting results could also be improved by pairing lubricants with other methods such as polishing the substrate using a polishing machine. These findings serve as a guide to recommend appropriate methods, choice, and amount of lubricant, to improve the efficiency and results of the nanoimprinting process. | URI: | https://hdl.handle.net/10356/148930 | Fulltext Permission: | restricted | Fulltext Availability: | With Fulltext |
Appears in Collections: | MAE Student Reports (FYP/IA/PA/PI) |
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File | Description | Size | Format | |
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FYP A142.pdf Restricted Access | improving nanoimprinting for copper nanowire fabrication | 9.97 MB | Adobe PDF | View/Open |
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