Please use this identifier to cite or link to this item:
https://hdl.handle.net/10356/148984
Title: | Machine learning with DSP for condition monitoring system | Authors: | Ng, Zhi Sheng | Keywords: | Engineering::Electrical and electronic engineering | Issue Date: | 2021 | Publisher: | Nanyang Technological University | Source: | Ng, Z. S. (2021). Machine learning with DSP for condition monitoring system. Final Year Project (FYP), Nanyang Technological University, Singapore. https://hdl.handle.net/10356/148984 | Abstract: | Condition monitoring is the process of monitoring a parameter of condition in a system in order to identify a significant change which is indicative of a developing fault. It has a unique benefit in that conditions that would shorten normal lifespan can be addressed before they develop into a major failure. Using machine learning techniques, the big data gathered around a system can be analysed as a single coherent whole to draw conclusions about its current state of health. This project will develop a condition monitoring method using machine learning to detect defects on a real life system. A test jig will be used to mimic a real life system to collect sufficient data for machine learning. A DSP will be used to implement the machine learning algorithm. | URI: | https://hdl.handle.net/10356/148984 | Schools: | School of Electrical and Electronic Engineering | Fulltext Permission: | restricted | Fulltext Availability: | With Fulltext |
Appears in Collections: | EEE Student Reports (FYP/IA/PA/PI) |
Files in This Item:
File | Description | Size | Format | |
---|---|---|---|---|
FYP Report (Project No_ A2185-201).pdf Restricted Access | 2.25 MB | Adobe PDF | View/Open |
Page view(s)
363
Updated on Mar 27, 2025
Download(s) 50
26
Updated on Mar 27, 2025
Google ScholarTM
Check
Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.