Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/149362
Title: The design of CMOS-compatible plasmonic waveguides for intra-chip communication
Authors: Liu, Yan
Ding, Lu
Cao, Yu
Wan, Dongyang
Yuan, Guanghui
Huang, Baohu
Thean, Aaron Voon-Yew
Mei, Ting
Venkatesan, Thirumalai
Nijhuis, Christian A.
Chua, Soo-Jin
Keywords: Science::Physics
Issue Date: 2020
Source: Liu, Y., Ding, L., Cao, Y., Wan, D., Yuan, G., Huang, B., Thean, A. V., Mei, T., Venkatesan, T., Nijhuis, C. A. & Chua, S. (2020). The design of CMOS-compatible plasmonic waveguides for intra-chip communication. IEEE Photonics Journal, 12(5), 4800810-. https://dx.doi.org/10.1109/JPHOT.2020.3024119
Project: NRF2016_CRP001_111
Journal: IEEE Photonics Journal
Abstract: A CMOS-compatible plasmonic waveguide with a metal or metal-like strip sandwiched in-between dielectrics has been proposed for intra-chip communication in the more-than-Moore era. A sequence of numerical models has been presented to evaluate the plasmonic waveguide performance. For device-level consideration, we demonstrated through simulations that Cu (1450 nm pitch) and PLD-TiN (900 nm pitch) plasmonic waveguides symmetrically sandwiched by SiO₂ with much smaller and hence denser interconnects,are promising candidates for use in global wires for the asynchronous communication. This design of plasmonic waveguide can bridge the CMOS circuitry and high-speed communication at optical frequencies within chip. For a system-level assessment, both of them have the same bandwidth throughput of∼19.8 Gbps. The other performance parameters of Cu and PLD-TiN plasmonic waveguides are respectively, signal latency of ∼0.18 ps and 0.19 ps,energy dissipation per computing bit of ∼2.5×10⁻³ fJ/bit and 3.8×10⁻³ fJ/bit, and 25% crosstalk coupling length of 155μm and 125μm. These findings suggest that plasmonic waveguide for intra-chip communication surpass those of existing electronic interconnects for all the categories of performance parameters.
URI: https://hdl.handle.net/10356/149362
ISSN: 1943-0655
DOI: 10.1109/JPHOT.2020.3024119
Rights: © 2020 The Author(s). This work is licensed under a Creative Commons Attribution 4.0 License. For more information, see https://creativecommons.org/licenses/by/4.0/
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:SPMS Journal Articles

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