Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/149972
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dc.contributor.authorLee, Shawn Wei Hanen_US
dc.date.accessioned2021-06-10T04:49:15Z-
dc.date.available2021-06-10T04:49:15Z-
dc.date.issued2021-
dc.identifier.citationLee, S. W. H. (2021). Temperature compensation for analog machine learners (II). Final Year Project (FYP), Nanyang Technological University, Singapore. https://hdl.handle.net/10356/149972en_US
dc.identifier.urihttps://hdl.handle.net/10356/149972-
dc.description.abstractThe widespread adoption of the Internet of Things (IoT) in everyday life has increased demand for ever-increasing computational resources in cloud computing. The use of analogue processing and the extreme machine learning (ELM) algorithm in the design of ultra-low power machine learners for "smart" sensors has proven to be beneficial. However, due to sub-threshold transistor operation, the reliance of these systems' weights on temperature cannot be overlooked. The aim of this project is to use behavioral simulations to determine the best form of temperature behavior for current reference in this framework. State-of-the-art IC modeling software and CMOS processes will be used to design and simulate the corresponding circuitsen_US
dc.language.isoenen_US
dc.publisherNanyang Technological Universityen_US
dc.relationA2018-201en_US
dc.subjectEngineering::Electrical and electronic engineeringen_US
dc.titleTemperature compensation for analog machine learners (II)en_US
dc.typeFinal Year Project (FYP)en_US
dc.contributor.supervisorArindam Basuen_US
dc.contributor.schoolSchool of Electrical and Electronic Engineeringen_US
dc.description.degreeBachelor of Engineering (Electrical and Electronic Engineering)en_US
dc.contributor.supervisoremailarindam.basu@ntu.edu.sgen_US
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Appears in Collections:EEE Student Reports (FYP/IA/PA/PI)
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