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Title: A development on the integration of BIM with RFID to improve the precast logistic management and installation system
Authors: Lee, Bernice Ser Li
Keywords: Engineering::Civil engineering
Issue Date: 2021
Publisher: Nanyang Technological University
Source: Lee, B. S. L. (2021). A development on the integration of BIM with RFID to improve the precast logistic management and installation system. Final Year Project (FYP), Nanyang Technological University, Singapore.
Abstract: Singapore’s Construction industry has been constantly improving over the years. The adaptation of many technologies has been made to advance forward. The objective of the research is to study the efficiency in precast logistic management and installation. Comparison between past project information and future predictions have been made to further improve the existing programme integrating BIM with RFID in the precast manufacturing chain. By analysing past data, background interface and data sheet formats, the aim of this study to improve the overall workflow in precast construction. This would allow the programme to be more versatile in adapting many types of precast construction projects. The development of a generic system for process workflow has been set up. This project proposes to develop a system that would benefit future implementation through all workflow in construction projects. The setting up of a generic labelling system have been implemented as well as new data sheet formats to improve the interface within the cloud base platform. In addition, a webpage has been developed to aid the management system and conclude all the work processes and data. Accessing from the management level down to the worker level, laborious processes have been streamlined to benefit the system. This would aid the management level and make processes simpler for all key personnel in a project.
Schools: School of Civil and Environmental Engineering 
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:CEE Student Reports (FYP/IA/PA/PI)

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