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Title: Carbon nanostructures dedicated to millimeter-wave to THz interconnects
Authors: Brun, Christophe
Tan, Chong Wei
Franck, Pierre
Chong, Yap Chin
Lu, Congxiang
Leong, Chow Wai
Tan, Dunlin
Tay, Beng Kang
Coquet, Philippe
Baillargeat, Dominique
Keywords: Engineering::Electrical and electronic engineering
Issue Date: 2015
Source: Brun, C., Tan, C. W., Franck, P., Chong, Y. C., Lu, C., Leong, C. W., Tan, D., Tay, B. K., Coquet, P. & Baillargeat, D. (2015). Carbon nanostructures dedicated to millimeter-wave to THz interconnects. IEEE Transactions On Terahertz Science and Technology, 5(3), 383-390.
Journal: IEEE Transactions on Terahertz Science and Technology
Abstract: This paper focuses on the use of CNTs for new mm-to-THz interconnects for nanopackaging. To successfully integrate CNT to be in line with nanoelectronics trends, new growth processes and modeling approaches are proposed. Several experimental works are presented such as millimeter-wave flip-chip bonding. In addition, novel THz 3-D wireless interconnect, based on CNT monopole antennas, working at 200 and 300 GHz are designed, simulated, and fabricated.
ISSN: 2156-342X
DOI: 10.1109/TTHZ.2015.2407859
Rights: © 2015 IEEE. All rights reserved.
Fulltext Permission: none
Fulltext Availability: No Fulltext
Appears in Collections:EEE Journal Articles

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