Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/151181
Title: Highly conductive aligned carbon film for interconnect application
Authors: Li, Fushan
Shakerzadeh, Maziar
Tan, Chong Wei
Yu, Hongyu
Tay, Beng Kang
Keywords: Engineering::Electrical and electronic engineering
Issue Date: 2010
Source: Li, F., Shakerzadeh, M., Tan, C. W., Yu, H. & Tay, B. K. (2010). Highly conductive aligned carbon film for interconnect application. 2010 3rd International Nanoelectronics Conference (INEC), 730-731. https://dx.doi.org/10.1109/INEC.2010.5424560
Abstract: We demonstrate here an amorphous carbon film with a highly conductive transition phase for interconnect application. The uniform orientation of graphite-like sheet provides an effective carriers transport channel, thus significantly improves the conductivity of the amorphous carbon film. The electrical properties of the aligned carbon film are investigated using Kelvin structure. Our results show that the resistivity of aligned carbon film is comparable with that of Cu, and the aligned carbon film holds promise for future interconnect application.
URI: https://hdl.handle.net/10356/151181
ISBN: 9781424435449
DOI: 10.1109/INEC.2010.5424560
Rights: © 2010 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. The published version is available at: https://doi.org/10.1109/INEC.2010.5424560.
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:EEE Conference Papers

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