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|Title:||Thermal conductivity enhancement of carbon@ carbon nanotube arrays and bonded carbon nanotube network||Authors:||Samani, Majid Kabiri
Tan, Chong Wei
Tay, Beng Kang
|Keywords:||Engineering::Electrical and electronic engineering||Issue Date:||2019||Source:||Samani, M. K., Lu, C., Kong, Q., Khosravian, N., Chen, G., Tan, C. W., Rudquist, P., Tay, B. K. & Liu, J. (2019). Thermal conductivity enhancement of carbon@ carbon nanotube arrays and bonded carbon nanotube network. Materials Research Express, 6(8), 085616-. https://dx.doi.org/10.1088/2053-1591/ab1e60||Project:||MOE2014-T2-2-105||Journal:||Materials Research Express||Abstract:||Carbon nanotubes (CNTs) are long considered as a promising material for thermal applications. However, problems such as low volume CNT fraction abhorrent to practical applications have been raising the demand for novel architecture of this material. Here we demonstrate two fabrication methods, in which a self-assembly method for fabricating covalent-bonded CNT network (3D CNT) and another method for covalent-bonded C to CNTs (C@CNT) network, and presented both as a potential method to enhance thermal conductivity of CNT arrays. We utilized pulsed photothermal reflectance technique and using new four-layer heat conduction model based on the transmission-line theory to measure thermal conductivity of the samples. The 3D CNT with thermal conductivity of 21 W mK−1 and C@CNT with thermal conductivity of 26 W mK−1 turn out to be an excellent candidate for thermal interface material as the thermal conductivity increased by 40% and 70% respectively as compared to conventional CNT arrays. The improvement is attributed to the efficient thermal routines constructed between CNTs and secondary CNTs in 3D CNT and between C layer and CNTs in C@CNT. The other factor to improve thermal conductivity of the samples is decreasing air volume fraction in CNT arrays. Our fabrication methods provide a simple method but effective way to fabricate 3D CNT and C@CNT and extend the possibility of CNTs towards TIM application.||URI:||https://hdl.handle.net/10356/151197||ISSN:||2053-1591||DOI:||10.1088/2053-1591/ab1e60||Rights:||© 2019 IOP Publishing Ltd. Original content from this work may be used under the terms of the Creative Commons Attribution 3.0 licence. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.||Fulltext Permission:||open||Fulltext Availability:||With Fulltext|
|Appears in Collections:||EEE Journal Articles|
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