Please use this identifier to cite or link to this item:
Full metadata record
DC FieldValueLanguage
dc.contributor.authorYan, Guangxuen_US
dc.contributor.authorBhowmik, Ayanen_US
dc.contributor.authorNagarajan, Balasubramanianen_US
dc.contributor.authorSong, Xuen_US
dc.contributor.authorTan, Sung Chynen_US
dc.contributor.authorTan, Ming Jenen_US
dc.identifier.citationYan, G., Bhowmik, A., Nagarajan, B., Song, X., Tan, S. C. & Tan, M. J. (2019). Bonding temperature effects on the wide gap transient liquid phase bonding of Inconel 718 using BNi-2 paste filler metal. Applied Surface Science, 484, 1223-1233.
dc.description.abstractTransient liquid phase (TLP) bonding of Inconel 718 with BNi-2 filler metal has traditionally been carried out using thin filler metal (narrow gap) to achieve complete eutectic-free isothermal solidification layer joints. However, for the aerospace components with relatively large cracks or worn areas where a large amount of filler metal is needed, narrow gap TLP bonding is insatiable to meet the bonding requirements. In this paper, wide gap TLP bonding of Inconel 718 with the BNi-2 paste filler metal was carried out in a vacuum furnace. The bonding temperature effects on the interfacial microstructure, phase evolution and the mechanical properties of the bonded joints were investigated. It was found that the ultimate tensile bonding strength increased by 98% as the bonding temperature increased from 1015 °C to 1150 °C and the joint with the maximum tensile strength of 482 MPa was achieved after bonding at 1150 °C for 15 mins. However, more adverse heating was induced on the base metal of the joint under a higher bonding temperature. In addition, increasing bonding temperature from 1015 °C to 1150 °C improved the local plasticity of the bonded joints owing to the reduction of the homogeneously distributed Ni₃B type borides to a more heterogeneous distribution of borides.en_US
dc.description.sponsorshipNational Research Foundation (NRF)en_US
dc.relation.ispartofApplied Surface Scienceen_US
dc.rights© 2019 Published by Elsevier B.V. All rights reserved.en_US
dc.subjectEngineering::Mechanical engineeringen_US
dc.titleBonding temperature effects on the wide gap transient liquid phase bonding of Inconel 718 using BNi-2 paste filler metalen_US
dc.typeJournal Articleen
dc.contributor.schoolSchool of Mechanical and Aerospace Engineeringen_US
dc.contributor.researchRolls-Royce@NTU Corporate Laben_US
dc.contributor.researchSingapore Institute of Manufacturing Technologyen_US
dc.contributor.researchAgency for Science, Technology and Research (A*STAR)en_US
dc.subject.keywordsBonding Temperatureen_US
dc.subject.keywordsMicrostructure and Mechanical Propertiesen_US
dc.description.acknowledgementThis work was conducted within the Rolls-Royce@NTU Corporate Laboratory with the support from National Research Foundation (NRF) Singapore under the NRF-RR-NTU research grant number M-RT3.2.en_US
item.fulltextNo Fulltext-
Appears in Collections:MAE Journal Articles

Page view(s)

Updated on Jan 15, 2022

Google ScholarTM




Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.