Please use this identifier to cite or link to this item:
https://hdl.handle.net/10356/152168
Title: | A dual redundancy radiation-hardened flip-flop based on C-element in 65nm process | Authors: | Jaya, Gibran Limi Chen, Shoushun Siek, Liter |
Keywords: | Engineering::Electrical and electronic engineering | Issue Date: | 2017 | Source: | Jaya, G. L., Chen, S. & Siek, L. (2017). A dual redundancy radiation-hardened flip-flop based on C-element in 65nm process. 2016 International Symposium on Integrated Circuits (ISIC), 1-4. https://dx.doi.org/10.1109/ISICIR.2016.7829721 | Project: | NRF2014SAS-SRP001- 057(2) | Conference: | 2016 International Symposium on Integrated Circuits (ISIC) | Abstract: | We propose a radiation-hardened flip-flop immune to the Single Event Upset (SEU) effect. Immunity was achieved through the use of C-elements and redundant storage elements. We take advantage of the property of C-element in which it enters a high impedance mode when its inputs are of different logic values. Redundant storage nodes are then used to drive the C-elements so that a single upset pulse in any storage will be prevented from altering the state of the output of the Flip-Flop. The Flip-Flop was implemented using 48 transistors and occupied an area of 30.78 um2, using 65nm CMOS process. It consumed 22.6% less transistors as compared to the traditional SEU resilient TMR Flip-flop. | URI: | https://hdl.handle.net/10356/152168 | ISBN: | 9781467390194 | DOI: | 10.1109/ISICIR.2016.7829721 | Schools: | School of Electrical and Electronic Engineering | Research Centres: | VIRTUS, IC Design Centre of Excellence | Rights: | © 2016 IEEE. All rights reserved. | Fulltext Permission: | none | Fulltext Availability: | No Fulltext |
Appears in Collections: | EEE Conference Papers |
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