Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/152412
Title: 3D printing of multilayered and multimaterial electronics : a review
Authors: Goh, Guo Liang
Zhang, Haining
Chong, Tzyy Haur
Yeong, Wai Yee
Keywords: Engineering::Mechanical engineering
Issue Date: 2021
Source: Goh, G. L., Zhang, H., Chong, T. H. & Yeong, W. Y. (2021). 3D printing of multilayered and multimaterial electronics : a review. Advanced Electronic Materials, 7(10), 2100445-. https://dx.doi.org/10.1002/aelm.202100445
Project: PUB-1804-0075 
Journal: Advanced Electronic Materials 
Abstract: 3D printing, also known as additive manufacturing, is a manufacturing process in which the materials are deposited layer by layer in an additive manner. With the advancement in materials and manufacturing technology, 3D printing has found its applications in the field of electronics manufacturing. Initially, 3D printing is used for the fabrication of electronic components with single material designs such as resistors, inductors, circuits, antennas, strain gauges, etc. Recently, there are many works involving the use of 3D printing fabrication techniques for advanced electronic components and devices such as parallel plate capacitors, inductors, organic light-emitting diodes, photovoltaics, transistors, displays, etc. which involve multilayer multimaterial printing. Despite these many works, there has been no review on the design and fabrication consideration for the 3D printing of multilayered and multimaterial (MLMM) electronics. As such, this review aims to summarize the current landscape of 3D printing of MLMM electronics and provide some insights on the design consideration, fabrication strategies, and challenges of 3D printing of MLMM electronics. In particular, the focus will be placed on discussing the interface conditions between different materials such as surface wettability, surface roughness, material compatibility, and the considerations for postprocessing treatments.
URI: https://hdl.handle.net/10356/152412
ISSN: 2199-160X
DOI: 10.1002/aelm.202100445
Schools: School of Mechanical and Aerospace Engineering 
School of Civil and Environmental Engineering 
Research Centres: Singapore Centre for 3D Printing 
Singapore Membrane Technology Centre 
Nanyang Environment and Water Research Institute 
Rights: This is the peer reviewed version of the following article: Goh, G. L., Zhang, H., Chong, T. H. & Yeong, W. Y. (2021). 3D printing of multilayered and multimaterial electronics : a review. Advanced Electronic Materials, 7(10), 2100445-, which has been published in final form at https://doi.org/10.1002/aelm.202100445. This article may be used for non-commercial purposes in accordance with Wiley Terms and Conditions for Use of Self-Archived Versions.
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:CEE Journal Articles
MAE Journal Articles
NEWRI Journal Articles
SC3DP Journal Articles

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