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Title: Advanced 3D integration technologies in various quantum computing devices
Authors: Zhao, Peng
Lim, Yu Dian
Li, Hong Yu
Guidoni, Luca
Tan, Chuan Seng
Keywords: Engineering::Electrical and electronic engineering
Issue Date: 2021
Source: Zhao, P., Lim, Y. D., Li, H. Y., Guidoni, L. & Tan, C. S. (2021). Advanced 3D integration technologies in various quantum computing devices. IEEE Open Journal of Nanotechnology, 2, 101-110.
Project: NRF2020- NRF-ANR073 HIT
Journal: IEEE Open Journal of Nanotechnology
Abstract: As a key approach to augment Moore’s Law scaling, 3D integration technologies have enabled small form factor, low cost, diverse, modular and flexible assembly of integrated circuits in the semiconductor industry. It is therefore essential to adopt these technologies to the quantum computing devices which are at the nascent stage and generally require large scale integration to be practical. In this review, we focus on four popular quantum bit (qubit) candidates (trapped ion, superconducting circuit, silicon spin and photon) which are encoded by distinct physical systems but all intrinsically compatible with advanced CMOS fabrication process. We introduce the specific scalability bottlenecks of each qubit type and present the current solutions using 3D integration technologies. We evaluate and classify these technologies into three main categories based on the hierarchy. A brief discussion regarding to the thermal management is also provided. We believe this review serves to provide some useful insights on the contributions of interconnect, integration and packaging to the field of quantum computing where rapid development is ongoing.
ISSN: 2644-1292
DOI: 10.1109/OJNANO.2021.3124363
Rights: © 2021 The Author(s). Published by IEEE. This work is licensed under a Creative Commons Attribution 4.0 License. For more information, see
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:EEE Journal Articles

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