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dc.contributor.authorShiau, Li Lynnen_US
dc.contributor.authorGoh, Simon Chun Kiaten_US
dc.contributor.authorWang, Xinglien_US
dc.contributor.authorZhu, Minminen_US
dc.contributor.authorTan, Chuan Sengen_US
dc.contributor.authorLiu, Zhengen_US
dc.contributor.authorTay, Beng Kangen_US
dc.identifier.citationShiau, L. L., Goh, S. C. K., Wang, X., Zhu, M., Tan, C. S., Liu, Z. & Tay, B. K. (2019). Graphene-metal nanoparticles for enhancing thermoelectric power factor. IEEE Transactions On Nanotechnology, 18, 1114-1118.
dc.description.abstractChemical vapor deposition (CVD) grown graphene has been reported for a myriad of nanoelectronics and nanophotonics applications. However, CVD grown graphene suffers from low electrical conductivity due to the presence of multiple grain boundaries and intragranular defects. In order to improve its performance, graphene is often functionalized with other materials. In this work, graphene was hybridized with metallic nanoparticles (Au, Ag and Pt). Metal-containing inorganic compound solution was drop casted onto patterned graphene and was subsequently reduced by ultraviolet light. The hybridized graphene systems were explored as possible thermoelectric generators. It was shown that nanoparticles hybridized graphene displayed a significant decrease in sheet resistance. Amongst them, Au-graphene revealed an 80% decrease in sheet resistance. Ag- and Pt-graphene did not show any enhancement in the Seebeck effect while Au-graphene observed a 25% decline due to the thermal cooling effect. Overall, thermoelectric power factor was shown to increase by a factor of 2.96, 1.72 and 1.25 times for Au-graphene, Ag-graphene, and Pt-graphene, respectively.en_US
dc.description.sponsorshipMinistry of Education (MOE)en_US
dc.relation.ispartofIEEE Transactions on Nanotechnologyen_US
dc.rights© 2019 IEEE. All rights reserved.en_US
dc.subjectEngineering::Electrical and electronic engineeringen_US
dc.titleGraphene-metal nanoparticles for enhancing thermoelectric power factoren_US
dc.typeJournal Articleen
dc.contributor.schoolSchool of Electrical and Electronic Engineeringen_US
dc.contributor.organizationExcelitas Technologies, Singaporeen_US
dc.description.acknowledgementThis work was supported by the Ministry of Education, Singapore under Grant MOE2015-T2-2-043. The review of this letter was arranged by Associate Editor G.-B. Lee.en_US
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