Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/154686
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dc.contributor.authorSing, Swee Leongen_US
dc.contributor.authorLam, Lit Pingen_US
dc.contributor.authorZhang, Dan Qingen_US
dc.contributor.authorLiu, Zhong Hongen_US
dc.contributor.authorChua, Chee Kaien_US
dc.date.accessioned2022-01-05T07:25:07Z-
dc.date.available2022-01-05T07:25:07Z-
dc.date.issued2015-
dc.identifier.citationSing, S. L., Lam, L. P., Zhang, D. Q., Liu, Z. H. & Chua, C. K. (2015). Interfacial characterization of SLM parts in multi-material processing : intermetallic phase formation between AlSi10Mg and C18400 copper alloy. Materials Characterization, 107, 220-227. https://dx.doi.org/10.1016/j.matchar.2015.07.007en_US
dc.identifier.issn1044-5803en_US
dc.identifier.urihttps://hdl.handle.net/10356/154686-
dc.description.abstractMulti-material processing in selective laser melting (SLM) using AlSi10Mg and UNS C18400 copper alloy was carried out. The interfacial characteristics were analyzed with FIB, SEM, XRD, EDS and EBSD techniques. Al2Cu intermetallic compound was formed at the Al/Cu bond interface after the SLM process. The tensile strength of Al/Cu SLM parts was evaluated to be 176 ± 31 MPa and flexural strength under a 3 point bending test was evaluated to be around 200 MPa for Cu at root and 500 MPa for Al at root. Further analysis suggested that the formation of intermetallic compounds translated the fracture mechanism at the interface from ductile to brittle cleavage. The microhardness values also varied along the interface with high microhardness at the interface due to the intermetallic compounds.en_US
dc.language.isoenen_US
dc.relation.ispartofMaterials Characterizationen_US
dc.rights© 2015 Elsevier Inc. All rights reserved. This paper was published in Materials Characterization and is made available with permission of Elsevier Inc.en_US
dc.subjectEngineering::Mechanical engineeringen_US
dc.titleInterfacial characterization of SLM parts in multi-material processing : intermetallic phase formation between AlSi10Mg and C18400 copper alloyen_US
dc.typeJournal Articleen
dc.contributor.schoolSchool of Mechanical and Aerospace Engineeringen_US
dc.contributor.researchSingapore Centre for 3D Printingen_US
dc.identifier.doi10.1016/j.matchar.2015.07.007-
dc.description.versionAccepted versionen_US
dc.identifier.scopus2-s2.0-84945749676-
dc.identifier.volume107en_US
dc.identifier.spage220en_US
dc.identifier.epage227en_US
dc.subject.keywordsAdditive Manufacturingen_US
dc.subject.keywordsMulti-Materialen_US
item.grantfulltextopen-
item.fulltextWith Fulltext-
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